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EnerChip CC CBC3150
CBC3150 9mm x 9mm DFN Package Drawing and Dimensions
Pin 1
Notes:
1. Dimensions in millimeters.
2. Package dimensions do not include mold flash, protrusions, burrs or metal
smearing.
3. Coplanarity applies to the exposed pad as well as the exposed terminals.
Maximum coplanarity shall be 0.08. Warpage shall not exceed 0.10.
4. Refer to JEDEC MO-229 outline.
5. Exposed metallized feature connected to die paddle.
6. There are 10 contact pads on two opposite sides and no contact pads on the
other two sides.
Handling EnerChips as MSL 3 Devices
EnerChip CBC050 devices are rated Moisture Sensitivity Level 3 and must be mounted and reflowed within 168
hours of being removed from the moisture barrier anti-static bag.
Soldering, Rework, and Electrical Test
Refer to the Cymbet User Manual AN-1026 for soldering, rework, and replacement of the EnerChip on printed
circuit boards, and for instructions on in-circuit electrical testing of the EnerChip.
DS-72-03 Rev F
?2009-2013 Cymbet Corporation ? Tel: +1-763-633-1780 ? www.cymbet.com
Page 15 of 16
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